Electronic Materials
Coating-REX
Photoimageable Dielectrics 130Lic
■ Benefits
- Negative type photo image able coating dielectrics
- Low temperature cureable and wide process margin
- Strong adhesion to glass substrate, metal film and ITO film and high chemical resistance
- Excellent transmittance, thermal stability and electrical properties
■ Features
| Process Condition | Film Thickness | 1～3 um |
|---|---|---|
| Exposure mode | ghi broad band | |
| Curing | 120℃ 1hr ～ 230℃ 30 min | |
| Photo resolution | > 4um | |
| Optical Properties | Transmittance | > 98% |
| Electrical Properties | Break Down Voltage | 2 MV/cm @ 1uA / cm2 |
| Dielectric Constant | 〜 4 @ 1MHz | |
| Mechanical Property | Pencil Hardness | 3H @ Load weight 750 g |
| Adhesion | Cross Cut test | 5B (0% area removed) on Glass |
| 5B (0% area removed) on ITO | ||
| 5B (0% area removed) on Metal |
■ Pattern Profile
130Lic is suitable for dielectric and passivation layer used in LCD and touch sensor panel that require low temperature curing and pattern formation
RASA INDUSTRIES, LTD.
Yaesu Dai Bldg., 1-1-1, Kyobashi, Chuo-Ku, Tokyo 104-0031
Phone : +81-3-3278-3831
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